热门搜索: 论文 发表 社科期刊 北大核心 南大核心 cssci 科技期刊 教育

铜电解精炼过程中砷锑铋杂质分布及其脱除研究

发布时间:2019-01-12 14:46  文章来源:笔耕文化传播
【摘要】:金川铜电解阳极板的原料成分日趋复杂,杂质含量超标给阴极铜的质量带来了危害,同时也给电解工艺控制和生产操作带来了极大困难。因此有必要对铜电解液杂质分布规律及工艺指标控制进行优化研究,以提升电解工艺对阳极板原料成分变化的适应性。根据阳极板原料特性,通过试验和试生产,摸索出了适合实际生产的新型添加剂ADT,并将其成功应用到了金川铜电解高电流密度生产中,电解液中悬浮物含量下降了1个数量级,使公司形成了具有自主知识产权的铜电解添加剂核心技术。针对金川铜电解液的净化工艺,在利用铜电解液深度脱铜净化技术处理电解后液过程中,通过优化与提升净化系统真空蒸发器—水冷结晶机的工艺技术控制条件,使一次结晶母液中铜离子浓度从35g/L左右降到15g/L以下,粗硫酸铜产出量增加2948t/a。在诱导脱铜工序中通过调整主辅给液的方式,使As、Sb和Bi的脱除率分别比设计值增加1%、5%和5%,黑铜板(渣)的产出量减少1125t/a,铜的直收率提高0.04%。根据电解生产铜离子浓差极化原理,将旋流电解技术应用到金川铜电解后液净化工艺中,重点研究了铜离子浓度在电流密度400A/m2~900A/m2及特定工艺技术条件下,提取金属铜及脱除砷、锑、铋等杂质的工艺技术条件控制思路,将原脱铜工艺进入渣中的铜以标准阴极铜的形式提取出来,在保证净化脱杂效率的前提下生产出符合GB/T467-1997(CATH-2)国家标准要求的阴极铜产品,且一、二段电流效率达到95%以上。通过技术进步,探索研究SF-11树脂对杂质Sb、Bi的选择性脱除效果,试验其穿透点、反洗效果及再生性能,得出SF-11树脂对Sb、Bi的脱除率可稳定达到85%以上。在模拟我厂大板电解槽内溶液的温度(63℃)条件下,通过补加高砷溶液,试验得出电解液中的As、Sb、Bi等杂质存在形成复合物从溶液中析出的共同效应,为铜电解净化除杂工艺开辟了新的思路。
[Abstract]:The raw material composition of Jinchuan copper electrolytic anode plate is becoming more and more complex, and the excessive impurity content brings harm to the quality of cathode copper, at the same time, it also brings great difficulties to the electrolysis process control and production operation. Therefore, it is necessary to optimize the distribution of impurities in copper electrolyte and the control of process index, so as to improve the adaptability of electrolytic process to the change of raw material composition of anode plate. According to the characteristics of anode plate, a new additive, ADT, which is suitable for practical production, has been found out by test and trial production and successfully applied to the high current density production of Jinchuan copper electrolysis. The content of suspended solids in electrolyte decreased by one order of magnitude, which made the company form the core technology of copper electrolysis additive with independent intellectual property. In view of the purification process of Jinchuan copper electrolyte, the technological control conditions of the vacuum evaporator and water-cooled crystallization machine in the purification system were optimized and promoted in the process of treating the post-electrolytic solution with the copper electrolyte deep decopper purification technology. The concentration of copper ion in primary crystallization mother liquor was decreased from about 35g/L to below 15g/L, and the output of crude copper sulfate increased by 2948 t / a. In the process of induced copper removal, the removal rate of As,Sb and Bi was increased by 1 / 5% and 5%, respectively, and the output of black copper (slag) was reduced by 1125t / a, and the direct yield of copper was increased by 0.04%. According to the principle of concentration polarization of copper ion produced by electrolysis, the swirl electrolysis technology was applied to the purification process of Jinchuan copper after electrolysis. The concentration of copper ion under the condition of current density 400A/m2~900A/m2 and specific technology was studied emphatically. The technological conditions for extracting metal copper and removing impurities such as arsenic, antimony, bismuth and so on are controlled. The copper from the original copper removal process into the slag is extracted in the form of standard cathode copper. The cathode copper products which meet the requirements of GB/T467-1997 (CATH-2) national standards are produced on the premise of purifying and removing impurity efficiency, and the current efficiency of the first and second stage is over 95%. Through the progress of technology, the selective removal effect of SF-11 resin on impurity Sb,Bi was studied. The penetration point, backwashing effect and regeneration performance of SF-11 resin were tested. It was concluded that the removal rate of Sb,Bi by SF-11 resin could reach more than 85%. Under the condition of simulating the temperature (63 鈩,

本文编号:2407896


论文下载
论文发表
教材专著
专利申请


    下载步骤:1.微信扫码 2.备注编号 2407896. 3.下载文档
    注:1.必须备注编号;2.正常10分钟可下载。有问题,加微信微信


    本文链接:http://www.bigengculture.com/falvlunwen/zhishichanquanfa/2407896.html